Book Chapter « Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization »
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Abdelkhalak El Hami et Philippe Pougnet. Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0 – insu-01154803
Impact of voids in interconnection materials
Dahoo P.-R., Khettab M., Chong C., Girard A., Pougnet. P.
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